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Mechanical shock test guidelines for solder joint reliability – CERN Document Server
In addition to BGA components, SGT also is an invaluable tool for analyzing failures on other discrete surface mount devices, such as capacitors and resistors. As awareness increases, it becomes obvious that SGT is a necessary tool for test-fixture vendors.
These estimates will, in turn, help suppliers define the strain targets necessary for their devices. Few leading fixture suppliers have embraced SGT as part of their product-validation process. Board-flexure control using 7903 gage measurement has become an effective method for preventing these failures. Research is still on-going to assess whether Iipc may be more fragile due to the formation of the interfacial intermetallics and the associated existence of Kirkendall voids near the interface.
IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability
Ip concerns demand that the bending and flexure of the PCB during assembly, test, handling and transportation, as well as actual product application, be characterized and controlled closely to safeguard the reliability of the lead-free PCBA interconnection.
These devices, though less susceptible than BGAs, can develop cracks that could propagate in field operations. Such baseline data can give component suppliers better estimates of end-use strain levels applied to devices.
There is a critical need for this test method, as designing test conditions that 9073 replicate these varied environments is becoming increasingly difficult. View shipping rates and policies Average Customer Review: Data are being accumulated by the industry on the reliability of components that are subjected to the higher soldering temperatures for SAC.
903 steps with excessive strain are identified for optimization. Write a customer review. With increased utilization of strain measurement in electronics manufacturing, different SGT methodologies have been developed.
Strain-related metrics provide component suppliers with a significant competitive advantage. This is critical during the early stages of the transition, a time when the industry has limited data on the effects of new elements introduced in the PCB, components and solder joints.
IPC/JEDEC MECHANICAL SHOCK TEST GUIDELINE FOR SOLDER JOINT RELIABILITY | JEDEC
The high strain imposed by clamps and test probes often make test fixtures a major culprit of solder-joint fracture due to excessive board flexure. Strain gage testing SGT allows objective analyses of strain conditions that SMT components are subjected to during assembly and test. For many vendors, cost is an important factor when implementing routine SGT on their fixtures. This information will enable iipc to execute SGT in a standardized and consistent manner.
The document also provides reference strain limits. Withoutabox Submit to Film Festivals. When paired with computational analysis techniques, SGT provides insights on the stresses that critical packages are subjected to during such conditions.
With the recognition that a growing need exists for the SGT of PCBAs, manufacturers of strain gages and related instruments have been developing products including applications know-how to meet the needs of users in this industry.
ComiXology Thousands of Digital Comics. Standardization December 31, Related Video Included. However, it is important to note that pro-active SGT can result ultimately in significant cost savings. ipf
Concerns about second-level interconnect SLI failures due to excessive flexure during board- and system-level assembly and test operations increase with the use of finer-pitch BGA components, thinner PCBs and lead-free interconnects Figure 1. Amazon Second Chance Pass it on, trade it in, give it a second life.
Shopbop Designer Fashion Brands. In addition to isolating potentially problematic operations, SGT validates that processes are operating within allowable strain levels. I’d like to read this book on Kindle Don’t have a Kindle? Most rely on customers to conduct these tests Figure 3.
This ranges from multiple high-acceleration shocks experienced by handheld devices to shipping-shock impulses on expensive enterprise infrastructure equipment. For EMS providers, SGT serves as a process-characterization tool and allows the pro-active identification of high-strain sequences during assembly and test.